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Key Components for Electronic Applications

Ceramic Substrates

A wide range of different key components for electronic applications (e.g. electronic circuit carriers) can be manufactured from ceramic substrates, which fulfil their function permanently and safely in various areas of application.

We offer a wide range of solutions for your specific requirements, whether medical technology, telecommunications, consumer electronics, electromobility or power generation - ceramic substrates are used everywhere due to their thermal, mechanical, insulating and chemical properties and enable us to network our world and advance modern technologies.

CeramTec is your One-Stop-Shop for all common ceramic substrates and offers everything from a single source: aluminium oxide, aluminium nitride (with a bending strength of 450 Mpa), zirconium toughened aluminium oxide ZTAzirconium oxide ZrO2 and in the course of 2024 also silicon nitride.

In addition to the ceramic substrates, this also includes engineering as well as laser processing and metallization of the substrates. The comprehensive one-stop-shop portfolio of ceramic materials enables our customers to source all major ceramic substrates from a single European manufacturer, supplement them as needed and streamline their supply chains.

CeramTec Substrates in Comparison

Material

Flexural strength
[Mpa]

CTE
[10^-6/K]

Thermal conductivity
[W/mK]

Dielectric strength
[kV/mm]

Al2O3

450

6 - 9

22

15

AlN

450

4 - 6

170

15

ZTA

625

7 - 9

21

25

 

Aluminium Oxide Substrates

  • Best cost/performance ratio
  • Most commonly used substrate in high-performance electronics
  • Fields of application: Industrial, Renewable and Vehicle Electrification

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Overview of CeramTec substrates in 2024
Electronic Circuit Carriers Substrates

Aluminium Nitride Substrates

  • High thermal conductivity 
  • CTE (Coefficient for Thermal Expansion) very close to silicon
  • Fields of application: Train, Industrial, Renewable and LED

More details

Zirconia Toughened Alumina Substrates

  • Improved flexural strength
  • Increased fracture toughness
  • Fields of application: Industrial, Renewable and Vehicle Electrification

More details

Zirconia Toughened Alumina Substrates
Silicon Nitride Substrate

Silicon Nitride Substrates

Launch in 2024

  • High flexural strength
  • High fracture toughness
  • Good thermal conductivity
  • Fields of application: Electro Vehicle, Vehicle Electrification, Industrial and Renweable

Zirconia ZrO2 Substrates

  • High flexural strength
  • High thermal insulation strength
  • Ideally suited for heating & sensor applications
  • Proven material in automotive applications
Zirconia Toughened Alumina Substrate
New Generation Ceramic Substrates

Performance & Advantages

Improved heat management thanks to the excellent thermal conductivity and high specific heat capacity of our ceramic substrates. Our technology also allows our customers to integrate a thick copper metallisation (DCB, AMB or SMB), which efficiently dissipates heat towards the heat sink.

 

Our ceramic substrates are characterised by a high packing density in terms of size and weight, which is achieved through their excellent ampacity, thermal conductivity and efficient heat spread with a thick copper metallisation by the customer.

At the same time, the low specific weight is maintained due to the low bulk density of the ceramic compared to, for example, metal. This makes our ceramic substrates the optimal choice for demanding applications where efficiency and performance are paramount.

First-class electromagnetic behaviour of ceramic: Thanks to the outstanding magnetic permeability of ceramic, the magnetic force effect remains unchecked and is not weakened by the ceramic.

Outstanding thermal conductivity of our ceramic materials, such as aluminium nitride (AlN), aluminium oxide (Al2O3), zirconium oxide-aluminium oxide (ZTA) and silicon nitride (Si3N4).

Thanks to the extraordinary lattice vibrations in ceramics (phonon resonance), they achieve remarkable heat dissipation compared to plastics. These properties make ceramics a first-class choice for heat-sensitive applications.

Increased longevity of our substrates through properties such as high bending strength and high fracture toughness. Our solutions are tailor-made to ensure extended service life of power modules in electric cars (e-mobility power modules) or longer maintenance intervals in wind power modules.

The chemically inert, corrosion resistant, catalytic and biocompatible properties of ceramics such as Al2O3, ZTA, AlN and Si3N4 offer our customers high chemical resistance.

Mechanical resistance through great elastic stiffness characterise our substrates. They offer exceptional strength under compressive loads as well as high hardness and wear resistance. Even at high temperatures, our materials retain their shape and properties, with a low density compared to metal.

Outstanding electrical insulation capacity of ceramics, which is achieved by the highest volume resistivity.

High dielectric constant of ceramics resulting from the excellent polarizability of this material in the electric field.

The excellent suitability for use in the high frequency range is ensured by a low dielectric loss factor or tan delta of the ceramic materials. A low dielectric loss factor is essential to ensure that the material has minimal energy loss and low attenuation effects on high frequency signals. This leads to improved efficiency and performance of high frequency components and systems.

 

Everything from one source

Lasered and Metallised Substrates

At CeramTec, we manufacture and process ceramic substrates using various processes depending on the application, material, geometry and number of pieces: From punching, lasering and dry pressing to various hard machining processes.

In addition, we also metallise the substrates ourselves, making them ideal for direct assembly with electronic components. The metallisation pastes are developed by ourselves and are characterised by high adhesive strength, good solder flow and excellent resistance in solder baths. In the process, a conductive layer is applied to the substrate to create the conductor paths and connections for the electronic components and to protect the substrate from corrosion or other environmental influences.

Configure Substrates Online

Configure substrates according to your own specifications

Describe your substrate or simply upload your technical drawing to receive a customised quote with different requirement quantities.
 

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RoHS Certification

A key prerequisite for CeramTec’s successful partnership with the electronics industry is the ability to deliver the right materials.

CeramTec offers the world’s top ceramic materials for thick and thin film technology and provides ceramics optimally designed to meet your specification profiles.

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Brochures & Data Sheets

EN
ENDE
Laser Processing of Ceramic Substrates
Powerful Laser Techniques
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Substrate Data Sheet: Zirconia Reinforced Alumina ZTA
Material properties of ZTA
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Substrate Data Sheet: Alunit AlN HP
Material Properties Aluminum Nitride
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Lasering of Ceramics
Solutions for miniaturizing trends in microelectronics
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Datasheet - Advanced Ceramics for Electronic Applications
Material properties of Rubalit®, Alunit® (Aluminum Nitride AlN) and Zirkolit®
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Related Links & Information

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