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Sinalit® Si3N4

Silicon Nitride Substrates

New from 2024: Substrates made of silicon nitride for innovative applications in e-mobility. With its exceptional flexural strength of ≥ 700 MPa, it enables the use of very thick copper metallizations of up to 1 mm, even with a substrate thickness of just 0.25 mm. This remarkable property opens up new horizons for Active Metal Brazing (AMB) and Sputter Metal Bonding (SMB) applications that require robust and reliable performance.

Wrecking ball hits a substrate and breaks

Thanks to the ability to use copper with a thickness of 1 mm, silicon nitride offers excellent current carrying capacity and heat spreading. This is crucial for the development of compact power modules that require high power densities with limited external dimensions.

Furthermore, silicon nitride scores with a fracture toughness of ≥ 6 MPa√m, which is crucial for maximum reliability and longevity in applications such as battery-powered electric vehicles. The outstanding insulation and dielectric strength of ≥ 25 kV AC/mm on thin Si3N4 substrates provides additional safety and enables the development of high power density power modules without compromising on safety.

Overall, CeramTec's silicon nitride is the ideal solution for e-mobility applications that require the highest performance, reliability and safety. Its exceptional robustness, combined with its outstanding flexural strength, fracture toughness and insulation resistance, makes it the first choice for the realization of high-performance and compact power components in the next generation of electric vehicles.

Si3N4 Substrates

Key Advantages

A modern car driving through wind power
Silicon Nitride Substrates - For High-end Performance in E-Mobility

Technical Values & Parameters

Physical properties  

  • Density: > 3.2 g/cm3

 

Surface properties

  • Ra value: < 0.5 µm

 

Mechanical properties

  • Flexural strength (double ring): ≥ 700 MPa
  • E-modulus: > 280 GPa
  • Vickers hardness: not specified

 

Thermal properties

  • CTE (coefficient of thermal expansion): 2.8 10-6 /K (40-400°C)
  • Specific heat capacity: > 0.6 J/g*K (20°C), 0.7 (100°C)
  • Thermal conductivity at 20°C: 80 W/m*K

Electrical properties

  • Dielectric constant at 1 MHz: 8.3
  • Dielectric loss factor at 1 MHz: 3 (10 )-3
  • Contact resistance at 20 °C: > 1014 (Ohm cm)
  • Dielectric strength: ≥ 25 kV/mm

 

Geometry

  • 5.5 "x7.5" x 0.013" (190.5 x 139.7 x 0.32mm)
  • 5.5 "x7.5" x 0.010" (190.5 x 139.7 x 0.25mm)

 

Substrates lasered

  • Length and width tolerance: + 0.2 - 0.05 mm (+/- 0.1 % lasered)
  • Thickness tolerance: +/-10% 

Download Datasheet

Material properties of Sinalit®
Silicon Nitride Si3N4 Substrates
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Ceramic Substrates Application Areas

List of materials and markets for CeramTec substrate solutions

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CeramTec Substrates in Comparison

MaterialFlexural strength
[Mpa]
CTE
[10^-6/K]
Thermal conductivity
[W/mK]
Dielectric strength
[kV/mm]
Al2O34506 - 92215
AlN4504 - 617015
ZTA6257 - 92125
Si3N47002 - 48025