Advanced Ceramics for the Semiconductor Industry
Over 120 years of experience in technical ceramics and many years of experience in the semi-conductor industry, combined with comprehensive material and process knowhow and outstanding product characteristics make us one of the key go-to solution partners, when it comes to ceramic components utilized in the semiconductor industry. Discover the advantages offered by our advanced ceramics portfolio and benefit from our solution expertise for a variety of handling and manufacturing processes in the semiconductor industry.
We manufacture our ceramic components and parts according to your individual application requirements, so you can design and maintain your processes flexibly and reliably. We have transitioned from a manufacturer of high quality ceramic components to a strong development partner who transforms your individual requirements into state of the art semiconductor products.
Indispensable for the Semiconductor Business
Whether in wafer processing, semiconductor manufacturing or handling - our components made of high-performance ceramics enable long-lasting performance and reliability.
CeramTec offers the right ceramic material for almost every requirement:
- Al2O3 – high purity and rigidity
- AlN – high thermal conductivity and electrical insulation
- SiSiC – low thermal expansion and density
- Si3N4 – high fracture toughness and low thermal expansion
Based on individual requirements, we can recommend the optimum material selection for the customer application. We are continuously improving key steps in our manufacturing process while simultaneously expanding our production capabilities.
Improved Key Process Steps to meet High Industry Demands
| KEY PROCESS STEPS | TECHNICAL PARAMETERS | REACHABLE VALUES/REQUIREMENTS |
| Hard machining - milling | Flatness, parallelism, Ra | Flatness < 1 μm Ra ≥ 0,05 μm" |
| Grinding | Flatness | 5 μm < Ø 200 mm / 10 μm > Ø 200 mm |
| Parallelism | 5 μm < Ø 200 mm / 10 μm > Ø 200 mm | |
| Roughness | Ra from 0,15 μm to 0,6 μm | |
| Eroding | Symmetrical positioning | up to 0,05 mm (holes/grooves positioning) |
| Lapping & polishing | Flatness, parallelism, Roughness | Ra from 0,06 μm to 0,35 μm Flatness < 2 μm Parallelism < 2 μm |
| Structuring | Roughness | Roughness < 3,2 μm Size < 150 μm |
| Special measurement | Local slope/local flatness | Objective resolution 50 nm - 25 μrad |
| Cleaning & packaging | Cleanliness | ISO 5 / Clean room 100 / package in clean room (based on customer request) |
- Basic Suitability of Ceramics
- Selection of Materials
- Tailored Design & Construction
- Prototypes
- Risk Management
- Simulating and Modeling
- Specification
- Quality Assurance
- Series Production
- Change Management
- Audits
- Product Training
- Application Training
- Further Development and Know-How Transfer
- Basic Suitability of Ceramics
- Selection of Materials
- Tailored Design & Construction
- Prototypes
- Risk Management
- Simulating and Modeling
- Specification
- Quality Assurance
- Series Production
- Change Management
- Audits
- Product Training
- Application Training
- Further Development and Know-How Transfer
