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Innovative CeramCool® Technology

Thermal Management with Ceramic Heat Sinks

Highly thermally conductive CeramCool® aluminium oxide and aluminium nitride ceramic heatsinks offer new possibilities for thermal management of high performance electronics, photovoltaics, LEDs and other applications. These convince with high electrical insulation, chemical resistance, corrosion resistance and numerous other strengths.

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PCB & Heat Sink effectively combined

CeramCool® heat sinks are an effective combination of PCB and heat sink for the safe cooling of thermally sensitive components and circuits. They enable direct and permanent connection of components and are ideal for thermal management and cooling of power-intensive circuits in high performance electronics, high power LEDs or photovoltaic systems.

Chip-on-heatsink technology eliminates the need for additional layers and thermal barriers required in traditional designs. In addition to reducing thermal resistance, this also reduces the number of components and potential sources of failure in the overall system. This has a positive impact on assembly time and ultimately system cost. When it comes to innovative thermal management with ceramic heatsinks, the following applies "Keep it simple" - a simplified system design optimises heat dissipation.

The ceramic materials used are Rubalit® aluminum oxide and Alunit® aluminum nitride, which can be provided with various metallisations and conductive path structures, if required also three-dimensionally and "around the edge". With chip-on-heatsink, CeramTec has also developed a process that enables optimal thermal coupling to the cooling medium. 

CeramCool® Heat Sinks

Features & Strengths

  • High electrical insulation with high thermal conductivity
  • High chemical resistance and corrosion resistance for long service life
  • Excellent high frequency characteristics
  • Heat-sink and circuit board in one (chip-on-heatsink)
  • Extremely low total thermal resistance Rth
  • Ground, directly metalizable surface
  • Metalizations: Cu (to 300 µm), Ag or W/Ni/Au
  • Cooling performance up to 1,000 W/cm2 (depending on coolant and permissible surface temperature)
  • Scalable to nearly any cooling performance
Ceramic heat sink for thermal management
E-Mobility Car Future

Innovative cooling solutions in eMobility

Would you like to learn more about our cooling solutions and thermal management made by CeramTec? Then discover our innovative ceramic solutions for numerous applications in eMobility.  

CeramTec eMobility

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Electronics & Heat-Sinks
CeramCool® - Heat Sink for optimised Thermal Management
Electronics - Cooling Technology - Heat Management
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Electronics & Heat-Sinks
CeramCool® - Liquid Cooling
Cooling Systems for Extreme Power Densities
AutomotiveElectronics & Heat-Sinks
E-Mobility - Ceramic Heatsink in E-Mobility
Heat sink for optimised thermal management
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AutomotiveElectronics & Heat-Sinks
E-Mobility - Thermal Management with Ceramic Heatsink
E-Mobility - SiC power module
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Electronics & Heat-Sinks
Optimized Thermal Management
Advanced Ceramic Materials for Power Electronics
CT MaterialsElectronics & Heat-SinksSubstrates
Datasheet - Advanced Ceramics for Electronic Applications
Material properties of Rubalit®, Alunit® (Aluminum Nitride AlN) and Zirkolit®