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Achieving maximum performance in minimum space inevitably means that power semiconductors develop ever higher temperatures. To protect the components and connection technology, this heat must be dissipated quickly and reliably. This is where CeramTec's aluminium nitride ceramic Alunit® sets standards.
Substrates made of aluminium nitride AlN HP convince with outstanding thermal and electrical properties, high flexural strength (450MPa), longer durability (thermocycling), excellent thermal conductivity (170W/mK) as well as high resistance to abrasion and and oxidation. This makes AlN HP perfectly suited for very high performance in electronics and is used in trains & railways as well as in high power density modules.
Due to the coefficient of expansion adapted to chip materials, AlN HP is excellently suited as an insulation material in the field of power modules. Aluminium nitride substrates also have a significantly higher thermal conductivity with better temperature resistance and insulation capability than PCB materials. This makes such materials suitable for use in high-power LEDs and passive components such as chip resistors.
Aluminum Nitride (AlN) - Discover more information & examples of use