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Metallization directly on Ceramic Circuit Carriers

Metallized Substrates

CeramTec’s own metallized substrates are optimally suited for directly mounting electronic components onto ceramic.

CeramTec metallizes these substrates manufactured for use in electronic circuits in-house. CeramTec develops the metallization pastes itself and these pastes are characterized by their high bond strength, good solder flow and excellent stability in solder baths. With their superb mechanical, electrical and thermal properties, metallized substrates manufactured by CeramTec are used in power electronics, optoelectronics, sensor technology, in light diodes and as special, single-layer carriers for microelectronic semiconductors.

A blue metallised substrate is being machined.

Metallization Layer Formation

The tungsten base metallization is applied with layer thicknesses of a minimum of 6 μm in a screen printing process. The electroless nickel layer applied for improved solder flow has a minimum thickness of 2 μm. Other layer thicknesses are possible for special customer requirements. For galvanic nickel layers, it is essential to discuss the layout in advance to ensure proper electrical bonding between the individual metal surfaces.

On customer request a gold flash layer (approx. 0.1 µm) can be deposited in addition to the nickel layer for corrosion protection. Another possibility is to reinforce the electrolytic nickel layers with a bondable gold layer. Layers with soft soldering are also possible. Metallized feedthroughs are also available on customer request.


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