Material | Flexural strength | CTE | Thermal conductivity | Dielectric strength |
Al2O3 | 450 | 6 - 9 | 22 | 15 |
AlN | 450 | 4 - 6 | 170 | 15 |
ZTA | 625 | 7 - 9 | 21 | 25 |
New in 2023: Substrates made of zirconia toughened alumina (Rubalit® ZTA) impress with their high flexural strength (625MPa), increased reliability (thermocycling) and a dielectric strength of AC: ≥ 25 kV/mm. ZTA is used in industrial applications, xEV (electric vehicles) as well as in the renewable energy sector.
In May 2023, the substrate Rubalit® ZTA was added to CeramTec's comprehensive product portfolio. ZTA is a mixed ceramic - consisting of aluminium oxide ceramic, which in turn is toughened with zirconium oxide particles. This combination has improved the properties of pure aluminium oxide. Increased fracture toughness, flexural strength and dielectric strength make the Rubalit® ZTA substrate more resistant to mechanical stress.
The thermal conductivity is more than 26 W/mK and the dielectric strength reaches 25 kV/mm. This makes Rubalit® ZTA significantly superior to common PCB materials, for example. Its thermal conductivity, temperature resistance and insulation properties also make the substrate an ideal material for use in passive components or chip resistors.
Interested? David Hassler, Product Manager Electronics at CeramTec, explains in a short interview why manufacturers of power electronics need the new ceramic substrate Rubalit® ZTA.