Material | Flexural strength | CTE | Thermal conductivity | Dielectric strength |
Al2O3 | 450 | 6 - 9 | 22 | 15 |
AlN | 450 | 4 - 6 | 170 | 15 |
ZTA | 625 | 7 - 9 | 21 | 25 |
The materials aluminium oxide Rubalit® and aluminium nitride Alunit® developed by CeramTec have established themselves worldwide as standard materials for electronic circuit carriers and are a byword for quality among all renowned manufacturers of hybrid circuits.
They convince with an excellent cost/performance ratio as well as their low thermal conductivity compared to nitride ceramics. They are used in industry, vehicle electrification and renewable energies.
Substrates made of Rubalit® Aluminium Oxide Ceramics
Rubalit® 708 S with 96% Al2O3
This ceramic material is characterized by its extremely high strength and thermal conductivity. The outstanding surface quality on both sides makes it the perfect companion for any commercial thick film paste and even makes it suitable for a number of thin film applications (sputtering).
Rubalit® 710 with 99.6% Al2O3
With its extremely fine surface quality, this ceramic material is designed especially to meet the highest demands in thin-film technology.
Rubalit® 708 HP – High Performance with 96% Al2O3
Rubalit® 708 HP offers consistently reliable and convincing performance even when subject to high thermal and electrical loads in terms of its:
- Thermocycling capability
- Thermal shock resistance
- Flexural strength
- Surface quality
- Thermal conductivity
This makes Rubalit® 708 HP ideal for power electronics in conjunction with direct copper bonding (DCB) and active metal brazing (AMB).
Aluminum Oxide (Al2O3) - Discover more information & examples of use
