CeramCool® heat-sinks are an effective combination of circuit board and heat-sink for the reliable cooling of thermally sensitive components and circuits. They enable the direct and permanent connection of components and are excellently suited for thermal management and cooling of high-power LEDs, photovoltaic systems or high-performance circuits in high-power electronics.
In addition to minimizing thermal resistance, eliminating additional layers and thus thermal barriers also reduces the number of components and potential sources of error in the overall system. This has a positive impact on the assembly process and ultimately on system cost. So the general rule for innovative thermal management with ceramic heat-sinks is: “Keep it simple” – a simplified system structure optimizes cooling.
The ceramic materials used are Rubalit® aluminum oxide and Alunit® aluminum nitride, which can feature a number of different metalizations and conductor path structures – if necessary, even three-dimensional and “around the edge”. With its chip-on-heatsink technique, CeramTec has developed a process that also enables optimal thermal coupling to the cooling medium.
- Extremely low total thermal resistance Rth
- Ground, directly metalizable surface
- Metalizations: Cu (to 300 µm), Ag or W/Ni/Au
- Cooling performance up to 1,000 W/cm2
(depending on coolant and permissible surface temperature)
- Scalable to nearly any cooling performance