Innovative cooling solution for e-mobility at PCIM Europe
Next week, the time has finally come: on Tuesday, May 4, 2021, at PCIM Europe - the leading international trade fair and conference for power electronics, intelligent drive technology, renewable energy and energy management - our latest innovation will be presented: A cooling system that works according to the CeramTec Chip-on-Heat Sink technology. The use of this cooling technology will be demonstrated using a SiC power module.
The presentation will be given by Mr. Hubert Rauh from our project partner, the Fraunhofer Institute for Integrated Systems and Device Technology IISB in Erlangen, as part of an online lecture on Chip-on-Heat Sink technology and the SiC Power Module from 15:30-16:00. The SiC Power Module is a ceramic power module for drive inverters and an innovative cooling solution for power electronics in e-mobility powertrains.
PCIM Europe will be held online for the second year in a row. All virtual visitors to the show will have the opportunity to chat with our colleagues on topics such as ceramic solutions for e-mobility, substrates for circuit carriers, coolers for thermal management, sensors as well as piezoceramics.
You are interested and would like to attend? Event tickets (free of charge depending on the scope) as well as all other information around the show can be found here.
More information about the ceramic power module for drive inverters.