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New High-Performance Aluminium Nitride Substrate

Improved flexural strength with outstanding thermal conductivity

Our new substrate Alunit® AlN HP (Aluminium Nitride High Performance) offers convincing advantages over conventional substrates with a 40 percent improved flexural strength combined with excellent thermal conductivity - for example, for applications in power generation and distribution, vehicle electrification and power converters for rail vehicle construction.

Due to its high flexural strength of ≥ 450 MPa, Alunit® AIN HP enables a permanent bond between the conductive metallisation and the ceramic substrate even under extreme temperature cycles. The thermal expansion coefficient of 3.7 - 5.7 ppm/K (at up to 300°C) is close to typical semiconductor materials. Thus, Alunit® AlN HP increases the continuous load capacity of power modules.

Other advantages of Alunit® AlN HP include its high thermal conductivity of 170 W/mK and its electrical insulation and dielectric strength of ≥15 kV/mm at 20 °C. Metallisation in copper or aluminium, as is common in power electronics, is also possible, as are DCB (Direct Copper Bonded) or AMB (Active Metal Brazing) ceramic substrates.

Ideally suited for high power and temperatures

Alunit® AlN HP is an excellent choice for use in high-voltage and high-performance power modules, but also for high-power LEDs and for chip resistors - even and especially at higher currents and in ever smaller components. In these application areas, the ceramic substrate Alunit® AlN HP is technically superior to PCB materials, for example. We offer the product as a substrate in the masterplate format of 138.0 x 190.5 x 0.635 mm; other thicknesses (e.g. 1.00 mm) are available on request.

Ceramics: Driver of modern technologies

With the development of the high-tech substrate Alunit® AlN HP, we are supporting the progressive decarbonisation and electrification of industry, for example in the areas of e-mobility, heating, cooling or also in the conversion and distribution of electrical energy. The electronic modules required for this have to meet extreme requirements with ever smaller dimensions: From optimal flexural strength to high thermal conductivity and excellent electrical insulation to minimal expansion coefficients.

Discover our diverse substrate solutions in our One-Stop-Shop. Everything from one source. Produced in Europe.